MK-BP2000 is a solder ball placer capable of automatically processing from flux printing to solder balls placement in high speed and high accuracy.
Screen printer side of the equipment
1.Pressurized stencil separation unit
2.Rotary squeegee unit
Ball placer side of the equipment
3.Round shaped XY driven ball placing head
4.Ball placement using a single stencil
Minami developed a unique solder ball supply cartridge made of special glass difficult to break due to the resin coating. Utilizing the principle of a sand clock, ball supply amount can be adjusted accurately.
Actual ball movement 〜Highly accurate ball placement is realized by reliable ball movement〜
By employment of a new round shaped placing head, solder balls on the stencil can be collected at the center of the head without applying physical force, and the ball placing accuracy and the production tact time are substantially improved due to high speed movement of over-spinning balls.
Because all solder balls moving on the stencil are moving in one direction, damage to the balls can be kept to a minimum level.
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Sucking effect of moving balls 〜 Realization of highly accurate placement by reliable ball movement 〜
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MK-BP2000 Ball placing unit
Because the placing head employs a structure where the air blows downward, tackiness between the balls after placement and the flux is improved.
Because the top of the solder ball is sticking out of the stencil top surface, the risk of double balls is reduced substantially.