Solder bump printing onto WLCSP (wafer level CSP)【Pattent】

■ Outline

1. Rewiring on wafer by a pressurized screen printer
2. Plane printing with hole shaped openings and isolated land shape printing

   (1). Insulation film forming on a wafer
   (2). Polyimide passivation film formation by printing
   (3). Plane printing with hole shaped opening and isolated land shape printing of Polyimide passivation film

3. Solder bump forming by pressurized and rotary squeegee printing

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