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Two stage solder thickness【Pattented】
This is a technology to print solder on a PCB where micro components and standard size components co-exist.
- A PCB where an area for micro components and an area for standard size components co-exist
When trying to print solder paste on such PCB using conventional screen printing technology, there was a problem of frequent mounting defects.
- Problem when printing with mask thickness of 150μm
The openings for micro components are too small with respect to the mask thickness, and as a result, the amount of solder filled is insufficient for the micro components.
- Problem when printing with mask thickness of 70μm
A defective mounting takes place due to insufficient solder in standard size component area.
- A mask design having two different thicknesses
The design for micro component area and the design for standard size component area are prepared on one mask.
- Micro component area solder printing 【 Mask thickness 70μm 】
- Mask area for standard size component
Because the micro component area of the special mask is half etched, the previously printed solder will not be damaged.
- The solder printing on standard size component area is completed. 【 Mask thickness 150μm 】
- An image after components have been mounted
- Please refer to the animation of the MK-888SV (LL) for the details.
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