High-spec Solder Ball Placer
Quality stabilization and high productivity by the Dual Table Transfer System
20 sec/pcs *At the PCB Type Dual Optimal conditions
Each process at the PCB type Dual are correspond one stencil (flux stencil / ball stencil 1 pcs on each)
Adaptive Materials | |
---|---|
Stencil Size (X)x(Y) |
1) 750mm x 750mm 2) 736mm x 736mm |
PCB Size (X) x (Y) |
Dual: 200mm x 60mm - 250mm x 250mm Single: 1) 50mm x 60mm - 360mm x 370 mm 2) 50mm x 60mm - 360mm x 170mm, φ300mm Thickness: 0.1mm - 2.5 mm |
Performance | |
Productivity | PCB : Type Dual 20secs / 1 sheet *Optimal conditions |
Print positioning repeatability accuracy | ±0.01mm |
Specification | |
Power supply utility | 3 phase 200V - 240V Frequency 50/60Hz |
Used air utility | 0.49MPa : 800NL/min |
Direction of setting work | 1) Left → Right 2) Right → Left |
Distribution line | From floor 900±20mm |
UI language | Japanese/English/Chinese/Korean |
Machine Weight | Approx. 2700kg |
Printing Direction | Front ↔ Rear / Left ↔ Right |
Vision FOV | 13.5mm x 10.8mm |
Software operating system | Windows 10 |
Lay-out | Dual type : (W)3040mm x (D)1800mm x (H)2000mm Except tower / monitor / FFU |
Option | |
Loader and Unloader system Wafer transfer Robot PCB Cleaner Warpage Correction Unit Fan filter unit ・ Ionizer |
MINAMI Co., Ltd. headquater ;38-32, 5-chome, Minami-cho, Fuchu-shi, Tokyo, Japan
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