Solder ball placing machine with a built-in high precision general purpose screen printer

Product Outline

• This is a solder ball placing machine which accomplishes solder ball placing automatically onto wafers or substrates of 50mm×50mm 〜 480mm×304.8mm size.
• All moving parts are controlled by servo motors, and this equipment is a highly functional and highly precision solder ball placing machine.
• Because the solder ball placing head scatters the solder balls without touching them by air curtain method, stable solder ball supply is accomplished without damaging or deforming the solder balls.
• Because the distance between the printed work and the stencil can be controlled, ball placing can be continued without contaminating the stencil.
• Uniquely designed head does not allow any ball from the previous work to remain precluding the risk of different size balls getting mixed when setting up for the next work using a different size ball.