Solder ball placer for PCB
PCB Size |
Weight : 70 〜 110mm Length : 200 〜 260mm |
|
---|---|---|
Ball Size |
0.085mm (Min) 〜 0.30mm (Max) 0.055mm (Min) 〜 |
For production R&D |
Ball Pitch | 0.12mm (Min) 〜 1.27mm (Max) | |
Solder Ball | Lead-Free & Normal Sn-Pb | |
Flux | Water soluble and Fat-solubility all |
Productivity | 23sec/1PCB (240x77.5mm) | |
---|---|---|
X axis accuracy Y axis accuracy θaxis accuracy |
Flux Printing Accuracy : ・0.02㎜ Ball Placing Accuracy : ・0.02㎜ (Repeatability of mechanical) |
Control Robot |
Printing Quality |
Uniform Flux Printing Uniform Ball Placing |
Control Pressure Range : 0.1〜10.0kgf/cm2 |
Power supply utility | Single phase 200~240V ±10% Frequency : 50/60Hz ±0.2Hz |
|
---|---|---|
Used air utility | Air pressure (CDA): 0.49MPa / 100NL/min N2 pressure :0.3MPa / 300NL/min |
|
Power outage compensation | UPS | |
Direction of setting work | Left → Right | |
Distribution line | Height : From floor 950・10mm | |
Sound level | Less than 75DB | |
UI language | English/Korean/Chinese/Japanese | |
Body color | Cover : SUS304 Frame : Black |
|
Machine Weight | 2,000kg | |
EHS information | SEMI S2 (excepting item16) standard | |
Lay-Out | 1,990mm(L)×1,305mm×(W)×1,750mm(H) |
MINAMI Co., Ltd. headquater ;38-32, 5-chome, Minami-cho, Fuchu-shi, Tokyo, Japan
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